Themis: Difference between revisions

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(Created page with "{{Infobox Chip | name = Themis | image = X816343-002.jpg | image_size = 150px | partnumber = X816343 | introduced = Early 2008 | designedby = Microsoft | type = GPU | clockspeed = 500MHz | process = 65nm (GPU die) | package = Unknown }} '''Themis''' is an engineering sample GPU likely created to evaluate final Gunga silicon. == Specifications == === GPU === {{GPU Specs}} * C22 stepping * 65nm process == Detail...")
 
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[[File:X816343-002-bga.jpg|thumb|150px|upright|right|Themis' BGA compared to a regular [[GPU]] (left) and [[XCGPU]] (right)]]
[[File:X816343-002-bga.jpg|thumb|150px|upright|right|Themis' BGA compared to a regular [[GPU]] (left) and [[XCGPU]] (right)]]


Little is known about Themis. The BGA layout is absolutely massive.
Little is known about Themis. The BGA layout is absolutely massive. The die etchings mention the Styx-90 stepping FS21, but it is not included on the package. The reason for this is unknown.


* Part Number: X816343
* Part Number: X816343

Revision as of 05:01, 5 April 2024

Themis
X816343-002.jpg
Part NumberX816343
IntroducedEarly 2008
Designed ByMicrosoft
TypeGPU
Clock Speed500MHz
Process65nm (GPU die)
PackageUnknown

Themis is an engineering sample GPU likely created to evaluate final Gunga silicon.

Specifications

GPU

  • 500Mhz clock speed
  • 48 floating-point vector processors divided into 3 dynamically scheduled SIMD groups (16 each)
  • Unified shader architecture
  • 16 texture addressing units
  • 16 texture filtering units
  • 8 pixel rendering pipelines
  • Direct access to CPU L2 cache
  • C22 stepping
  • 65nm process

Details

Themis' BGA compared to a regular GPU (left) and XCGPU (right)

Little is known about Themis. The BGA layout is absolutely massive. The die etchings mention the Styx-90 stepping FS21, but it is not included on the package. The reason for this is unknown.

  • Part Number: X816343