Y2 (GPU): Difference between revisions
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(Created page with "{{Infobox Chip | name = Y2 | image = X02127.jpg | image_size = 150px | partnumber = X02127 | introduced = Early 2007 | designedby = ATi<br>Microsoft<br>NEC (eDRAM) | codename = B13L | type = GPU | usedin = Zephyr_B | clockspeed = 500MHz | memory = 10MB eDRAM | process = 80nm (GPU die)<br>90nm (eDRAM die) | package = Flip-chip BGA1017 | predecessor = Y1 | successor = ...") |
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'''Y2''' an 80nm [[GPU]] used in the [[Xbox 360]]. It is the successor to [[Y1 (GPU)|Y1]] and has the '''B13L''' design. Minimal changes were required to move from the 90nm to the 80nm process. The eDRAM was not shrunk and remains on a 90nm process. | '''Y2''' is an 80nm [[GPU]] used in the [[Xbox 360]]. It is the successor to [[Y1 (GPU)|Y1]] and has the '''B13L''' design. Minimal changes were required to move from the 90nm to the 80nm process. The eDRAM was not shrunk and remains on a 90nm process. | ||
== Specifications == | == Specifications == | ||
Revision as of 19:00, 2 January 2023
| File:X02127.jpg | |
| Part Number | X02127 |
|---|---|
| Introduced | Early 2007 |
| Designed By | ATi Microsoft NEC (eDRAM) |
| Codename | B13L |
| Type | GPU |
| Used In | Zephyr_B |
| Clock Speed | 500MHz |
| Memory | 10MB eDRAM |
| Process | 80nm (GPU die) 90nm (eDRAM die) |
| Package | Flip-chip BGA1017 |
| Predecessor | Y1 |
| Successor | Rhea |
Y2 is an 80nm GPU used in the Xbox 360. It is the successor to Y1 and has the B13L design. Minimal changes were required to move from the 90nm to the 80nm process. The eDRAM was not shrunk and remains on a 90nm process.
Specifications
GPU
- 500Mhz clock speed
- 48 floating-point vector processors divided into 3 dynamically scheduled SIMD groups (16 each)
- Unified shader architecture
- 16 texture addressing units
- 16 texture filtering units
- 8 pixel rendering pipelines
- Direct access to CPU L2 cache
- 80nm process
eDRAM
- 10MB 256GB/s eDRAM
- Contains logic for:
- 4-sample anti-aliasing
- Alpha compositing
- Color
- Z/stencil buffering
- 90nm process
Details
This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip. No versions with higher Tg underfill were produced. Thus, no versions of this chip are known to be reliable.
- Part Number: X02127
- Foundries:
- Korea Foundry
- Taiwan Foundry