Y2 (GPU): Difference between revisions

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| clockspeed  = 500MHz
| clockspeed  = 500MHz
| memory      = 10MB [[eDRAM]]
| memory      = 10MB [[eDRAM]]
| process      = 80nm (GPU die)<br>90nm (eDRAM die)
| process      = 90nm (Both dies)
| package      = Flip-chip BGA1017
| package      = Flip-chip BGA1017
| predecessor  = [[Y1 (GPU)|Y1]]
| predecessor  = [[Y1 (GPU)|Y1]]
Line 17: Line 17:
}}
}}


'''Y2''' is an 80nm [[GPU]] used in the [[Xbox 360]]. It is the successor to [[Y1 (GPU)|Y1]] and uses the '''B13L''' core. Very late Y2's used the '''B14L''' core. Minimal changes were required to move from the 90nm to the 80nm process. The [[eDRAM]] was not shrunk and remains on a 90nm process.
'''Y2''', codename '''C2''', is a 90nm [[GPU]] and is used on the [[Zephyr#Zephyr_B|Zephyr_B]] motherboard. It is the successor to [[Y1 (GPU)|Y1]]. Improvements were made which shrunk the physical size of the die. The [[eDRAM]] was unchanged.


== Specifications ==
== Specifications ==
=== GPU ===
=== GPU ===
{{GPU Specs}}
{{GPU Specs}}
* 80nm process
* B13L or B14L [[stepping]]
* 90nm process


=== eDRAM ===
=== eDRAM (Edifis) ===
{{EDRAM Specs}}
{{EDRAM Specs}}
* ES3 (C00) [[stepping]]
* 90nm process
* 90nm process


== Details ==
== Details ==
[[File:X02127-002.jpg|thumb|150px|upright|right|A Korean Y2]]
[[File:X02127-002.jpg|thumb|150px|upright|right|A Korean Y2]]
The PCIe ballout was de-swizzled (flipped) for the [[Zephyr#Zephyr_B|Zephyr_B]] motherboard, making this chip incompatible earlier motherboards. {{Flip Chip Fault|t=overview}} {{Flip Chip Fault|t=nofixed}}
[[File:X02127-006.jpg|thumb|150px|upright|right|A B14L Y2]]
 
The PCIe ballout was de-swizzled (flipped) for the [[Zephyr#Zephyr_B|Zephyr_B]] motherboard, making this chip incompatible earlier motherboards. It uses the [[Edifis]] [[eDRAM]]. {{Flip Chip Fault|t=overview}} {{Flip Chip Fault|t=nofixed}}


* Part Number: X02127
* Part Number: X02127
* Foundries:
 
** {{Foundry|f=korea}}
== Prototypes ==
** {{Foundry|f=taiwan}}
Engineering Samples by [[stepping]].
 
=== B11 ===
First version.
 
* Part Number: Unknown
 
=== B11L ===
Low power version of B11.
 
[[File:X807072-001.jpg|150px]]
 
* Part Number: X807072-001
 
=== B12 ===
Minor update.
 
* Below chip is a B12 that appears to be later binned as B12L.
[[File:X807077-002.jpg|150px]]
 
* Part Number: X807077-002
 
=== B12L ===
Low power version of B12.
 
[[File:X807078-002.jpg|150px]]
 
* Part Number: X807078-002
 
=== B13L ===
Minor update. Engineering sample for the final B13L production chip.
 
* In the first picture, the second part number likely denotes binning
[[File:X807072-003.jpg|150px]]
 
[[File:X807074-003.jpg|150px]]
 
* Part Numbers:
** X807072-003
** X807074-003


{{Motherboard Components}}
{{Motherboard Components}}
[[Category:Motherboard Components]]
[[Category:Motherboard Components]]

Latest revision as of 20:37, 6 April 2024

Y2
X02127-004.jpg
Part NumberX02127
IntroducedEarly 2007
Designed ByATi
Microsoft
NEC (eDRAM)
CodenameC2
TypeGPU
Used InZephyr_B
Clock Speed500MHz
Memory10MB eDRAM
Process90nm (Both dies)
PackageFlip-chip BGA1017
PredecessorY1
SuccessorRhea

Y2, codename C2, is a 90nm GPU and is used on the Zephyr_B motherboard. It is the successor to Y1. Improvements were made which shrunk the physical size of the die. The eDRAM was unchanged.

Specifications

GPU

  • 500Mhz clock speed
  • 48 floating-point vector processors divided into 3 dynamically scheduled SIMD groups (16 each)
  • Unified shader architecture
  • 16 texture addressing units
  • 16 texture filtering units
  • 8 pixel rendering pipelines
  • Direct access to CPU L2 cache
  • B13L or B14L stepping
  • 90nm process

eDRAM (Edifis)

  • 10MB 256GB/s eDRAM
  • Contains logic for:
    • 4-sample anti-aliasing
    • Alpha compositing
    • Color
    • Z/stencil buffering
  • ES3 (C00) stepping
  • 90nm process

Details

A Korean Y2
A B14L Y2

The PCIe ballout was de-swizzled (flipped) for the Zephyr_B motherboard, making this chip incompatible earlier motherboards. It uses the Edifis eDRAM. This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip. No versions with higher Tg underfill were produced. Thus, no versions of this chip are known to be reliable.

  • Part Number: X02127

Prototypes

Engineering Samples by stepping.

B11

First version.

  • Part Number: Unknown

B11L

Low power version of B11.

X807072-001.jpg

  • Part Number: X807072-001

B12

Minor update.

  • Below chip is a B12 that appears to be later binned as B12L.

X807077-002.jpg

  • Part Number: X807077-002

B12L

Low power version of B12.

X807078-002.jpg

  • Part Number: X807078-002

B13L

Minor update. Engineering sample for the final B13L production chip.

  • In the first picture, the second part number likely denotes binning

X807072-003.jpg

X807074-003.jpg

  • Part Numbers:
    • X807072-003
    • X807074-003
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