Template:Flip Chip Fault: Difference between revisions

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{{#switch: {{{t}}}
{{#switch: {{{t}}}
| fixed = chips with higher Tg underfill began being produced. These chips are known to be reliable.
| fixed = chips with higher Tg underfill began being produced. These revised chips are known to be reliable.
| nofixed = No versions with higher Tg underfill were produced. Thus, no versions of this chip are known to be reliable.
| nofixed = No versions with higher Tg underfill were produced. Thus, no versions of this chip are known to be reliable.
| overview = This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip.
| overview = This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip.
| ufswitchdate = weeks 11 and 19 of 2008
| ufswitchdate = weeks 12 through 20 of 2008
| uvblack = underfill is black under UV light
| uvblack = underfill is black under UV light
| uvclear = underfill glows clear under UV light
| uvclear = underfill glows clear under UV light
| uvgreen = underfill glows green under UV light
| uvgreen = underfill glows green under UV light
}}
}}

Latest revision as of 12:48, 19 December 2023