Template:Flip Chip Fault: Difference between revisions
Jump to navigation
Jump to search
No edit summary |
No edit summary |
||
| (9 intermediate revisions by the same user not shown) | |||
| Line 1: | Line 1: | ||
{{#switch: {{{t}}} | {{#switch: {{{t}}} | ||
| fixed = | | fixed = chips with higher Tg underfill began being produced. These revised chips are known to be reliable. | ||
| nofixed = No versions with higher Tg underfill were produced. Thus, no versions of this chip are known to be reliable. | |||
| overview = This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip. | | overview = This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip. | ||
| uvblack = | | ufswitchdate = weeks 12 through 20 of 2008 | ||
| uvclear = | | uvblack = underfill is black under UV light | ||
| uvgreen = | | uvclear = underfill glows clear under UV light | ||
| uvgreen = underfill glows green under UV light | |||
}} | }} | ||