Template:Flip Chip Fault: Difference between revisions
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(Created page with "{{#switch: {{{f}}} | overview = This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip. }}") |
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{{#switch: {{{ | {{#switch: {{{t}}} | ||
| fixed = chips with higher Tg underfill began being produced. These revised chips are known to be reliable. | |||
| nofixed = No versions with higher Tg underfill were produced. Thus, no versions of this chip are known to be reliable. | |||
| overview = This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip. | | overview = This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip. | ||
| ufswitchdate = weeks 12 through 20 of 2008 | |||
| uvblack = underfill is black under UV light | |||
| uvclear = underfill glows clear under UV light | |||
| uvgreen = underfill glows green under UV light | |||
}} | }} | ||