Template:Flip Chip Fault: Difference between revisions
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| fixed = Starting sometime between weeks 11 and 19 of 2008, chips with higher Tg underfill began being produced. These chips are known to be reliable. | | fixed = Starting sometime between weeks 11 and 19 of 2008, chips with higher Tg underfill began being produced. These chips are known to be reliable. | ||
| nofixed = No versions with higher Tg underfill were produced, | | nofixed = No versions with higher Tg underfill were produced. Thus, no versions of this chip are known to be reliable. | ||
| overview = This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip. | | overview = This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip. | ||
| uvblack = underfill is black under UV light | | uvblack = underfill is black under UV light | ||