Template:Flip Chip Fault: Difference between revisions
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| overview = This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip. | | overview = This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip. | ||
| uvblack = The underfill is black under UV light. | | uvblack = The underfill is black under UV light. | ||
| | | uvclear = The underfill glows clear under UV light. | ||
| uvgreen = The underfill glows green under UV light. | | uvgreen = The underfill glows green under UV light. | ||
}} | }} | ||