Template:Flip Chip Fault: Difference between revisions
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| fixed = Starting sometime between weeks 11 and 19 of 2008, chips with higher Tg underfill began being produced. These chips are known to be reliable. | | fixed = Starting sometime between weeks 11 and 19 of 2008, chips with higher Tg underfill began being produced. These chips are known to be reliable. | ||
| overview = This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip. | | overview = This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip. | ||
| uvblack = The underfill is black under UV light | |||
| uvgray = The underfill glows light gray under UV light | |||
| uvgreen = The underfill glows green under UV light | |||
}} | }} | ||