Template:Flip Chip Fault: Difference between revisions
Jump to navigation
Jump to search
No edit summary |
No edit summary |
||
| Line 1: | Line 1: | ||
{{#switch: {{{t}}} | {{#switch: {{{t}}} | ||
| fixed = Starting sometime between weeks 11 and 19 of 2008, chips with higher Tg underfill began being produced. These chips are known to be reliable. | |||
| overview = This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip. | | overview = This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip. | ||
}} | }} | ||