Template:Flip Chip Fault: Difference between revisions

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(Created page with "{{#switch: {{{f}}} | overview = This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip. }}")
 
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| overview = This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip.
| overview = This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip.
}}
}}

Revision as of 16:47, 2 January 2023